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DEPOSITION TECHNOLOGIES
Techniques for high precision deposition
Combination of Large-Area Pulsed Laser Deposition
(LA-PLD) and
Magnetron Sputter Deposition (MSD)
- High precision deposition of nanometer single and multilayers
- Accuracy and homogeneity in the sub-nanometer range
- Multilayer stacks for a wide variety of applications
- Constant and graded thickness distributions
- Deposition of rectangular substrates and substrates up to 6 inch diameter (LA-PLD)
Deposition Technologies
Magnetron Sputter Deposition
Homogeneity: 99.9 % (6" diameter)
run-to-run stability: 99.9%
Performance of Mo/Si multilayers
Cu Ka reflectivity for d = 2.0 nm
R (Cu Ka) > 60%
EUV- range*: reflectivity for d = 6.82 nm:
R (l = 13.3 nm) = 70.1 %
Large-Area Pulsed Laser Deposition
Homogeneity: 99.5 % (80 mm x 40 mm)
run-to-run stability: 99.5 %
Cu Ka-reflectivity of a Ni/C-Multilayer
d = 3.0 nm: R = 68 %
Application of PLD: In-side deposition of tubes*
Glass tubes
(I.D. ≈ 10 mm), in-side deposited with Au, Cu, Ni, Pd, brass, C
* in cooperation with Fraunhofer IWS Dresden, Germany: